GPS Logger 10 Layer BGA PCB High Tg FR4 1.6mm 1oz With Green Mask BIC-5208112-V2 manufacturer from China BICHENG ENTERPRISE LIMITED

GPS Logger 10 Layer BGA PCB High Tg FR4 1.6mm 1oz With Green Mask

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: BIC-5208112-V2

GPS Logger 10 Layer BGA PCB High Tg FR4 1.6mm 1oz With Green Mask

PCB parameters
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GPS Logger 10 Layer BGA PCB High Tg FR4 1.6mm 1oz With Green Mask

PCB parameters

PCB SIZE	245 x 221mm=1PCS
BOARD TYPE
Number of Layers	Multilayer PCB, 10 Layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1oz)+plate TOP Signal
	4mil prepreg
	copper ------- 18um(0.5oz) GND Plane
	5mil FR-4
	copper ------- 18um(0.5oz) SIG1
	5mil prepreg
	copper ------- 18um(0.5oz) SIG2
	5mil FR-4
	copper ------- 18um(0.5oz) PWR Plane
	13mil prepreg
	copper ------- 18um(0.5oz) GND Plane
	5mil FR-4
	copper ------- 18um(0.5oz) SIG3
	5mil prepreg
	copper ------- 35um(1oz) SIG4
	5mil FR-4
	copper ------- 35um(1oz) GND Plane
	4mil prepreg
	copper ------- 35um(1oz)+plate BOT Signal
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minmum / Maximum Holes:	0.25/9.0mm
Number of Different Holes:	19
Number of Drill Holes:	5112
Number of Milled Slots:	2
Number of Internal Cutouts:	0
Impedance Control	Differential pairs impedance control and Single trace impedance control
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external:	1.5oz
Final foil internal:	0.5oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold (20.1%) 2µ" over 100µ" nickel
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), Ball grid array (BGA) package with via capped.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
APPLICATION:	Gps Logger
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages

a) FR-4 epoxy glass. UL94V0. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260

b) Immersion gold surface finish. Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

c) No MOQ, low cost for small quantity prototypes and samples.

d) ISO certified PCB manufacturing factory.

e) DDU Door to door shipment with competitive shipping cost.

More Applications in Electronics

Lan Switch
Gps Tracker For Car
Step Up Transformer
Usb Wireless
12 Volt Battery Charger
Wireless Speaker System

PCB knowledge: PCB Production Process

1. Contact PCB fabricator

Contact your satisfied vendor such as Bicheng. You’re registered and will be quoted for you. Place your order and follow up the production schedule.

2. Material cutting

Purpose: According to the requirement from engineering data, cut the large plate which is in compliance with the requirement into small pieces of production board piece to meet customer requirements of the small sheet.

3. Drill

Purpose: According to the requirement from engineering data, drill all the holes.

4. Copper deposition

Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical method

5. Pattern transfer

Purpose: Pattern transfer is the transfer of image production on the film to the board

6. Pattern plating

Purpose: Pattern electroplating is a layer of copper or gold over nickel or tin that requires a thickness plated on the exposed copper of the pattern graphic or on the hole wall.

7. Film stripping

Purpose: The NaOH solution is used to strip the anti-plating film to expose the non-pattern circuit layer.

8. Etching

Purpose: Etching is to etch off the non-circuit parts of the copper layer by chemical reaction method

9. Solder Mask

Purpose: Solder mask is transferring the solder mask film graphics to the board to protect the track and prevent the track from the effect of tin welding during assembly.