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Immersion Gold 2oz 4 Layer High Frequency PCB Digital Transmitter 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-040091-V1.2

Immersion Gold 2oz 4 Layer High Frequency PCB Digital Transmitter
 
PCB Parameter
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Immersion Gold 2oz 4 Layer High Frequency PCB Digital Transmitter

 

PCB Parameter

PCB SIZE 91 x 68mm=1PCS
BOARD TYPE
Number of Layers Multilayer PCB, 4 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 70um(2oz)+plate TOP layer
RO4350B 10 mil
no copper ------- MidLayer 1
RO4450B 4 mil
no copper ------- MidLayer 2
RO4450B 4 mil
RO4350B 10 mil
copper ------- 70um(2oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 13mil/15mil
Minmum / Maximum Holes: 0.3/3.21mm
Number of Different Holes: 5
Number of Drill Holes: 1680
Number of Milled Slots: 1
Number of Internal Cutouts: 1
Impedance Control no
BOARD MATERIAL
Glass Epoxy: Rogers RO4350B( core 10mil, DK=3.48) & RO4450B(PP 4mil DK=3.54)
Final foil external: 2oz
Final foil internal: 0oz
Final height of PCB: 0.8mm ±0.1
PLATING AND COATING
Surface Finish Immersion Gold (71.1%) 2µ" over 100µ" nickle
Solder Mask Apply To: no solder mask required
Solder Mask Color: no solder mask required
Solder Mask Type: no solder mask required
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend no silkscreen required
Colour of Component Legend no silkscreen required
Manufacturer Name or Logo: no silkscreen required
VIA Plated Through Hole(PTH), via open
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Digital transmitter, 4G Router
USB Bluetooth
USB Bluetooth Adapter
Adaptor
Antennas
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Advantages:

a) High frequency performance

b) Dielectric constant er 3.48

c) Low loss and high speed signal transmission.

d) Prototypes are offered for sale

 

More Applications in Electronics

Embedded Hardware
Embedded Systems Applications
Rf Power Amplifiers
Rf Modules
Switching Power

 

Design for Manufacture(DFM) (4)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
62 Surface finish Thickness of nickel of ENIG 3-5um 3-5um 2-6.35um
63 Thickness of Gold of ENIG 0.05-0.1um
64 Thickness of nickel of Gold finger 3-5um
65 Thickness of Gold of Gold finger 0.1-1.27um
66 Thickness of tin of HASL 2.54-6.35um
67 Thickness of OSP 0.2-0.5um
68 Thickness of tin of Immersion tin 0.2-0.75um
69 Thickness of silver of Immersion silver 0.15-0.75um
70 Contour process Method of contour process CNC milling, V-CUT, Break-out tap, break-out holes, Punching
71 Minimum router 0.8mm
72 Min.tolerance of contour ±0.15mm ±0.13mm ±0.1mm
73 Min.distance of milling contour(no copper exposure) 12mil 10mil 8mil
74 Angle of
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 Mr. Mr. Kevin Liao

Tel: 86-755-27374946
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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