Place of Origin: | Zhejiang, China (Mainland) |
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Immersion Gold 2oz 4 Layer High Frequency PCB Digital Transmitter
PCB Parameter
PCB SIZE | 91 x 68mm=1PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 4 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 70um(2oz)+plate TOP layer |
RO4350B 10 mil | |
no copper ------- MidLayer 1 | |
RO4450B 4 mil | |
no copper ------- MidLayer 2 | |
RO4450B 4 mil | |
RO4350B 10 mil | |
copper ------- 70um(2oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 13mil/15mil |
Minmum / Maximum Holes: | 0.3/3.21mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 1680 |
Number of Milled Slots: | 1 |
Number of Internal Cutouts: | 1 |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | Rogers RO4350B( core 10mil, DK=3.48) & RO4450B(PP 4mil DK=3.54) |
Final foil external: | 2oz |
Final foil internal: | 0oz |
Final height of PCB: | 0.8mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (71.1%) 2µ" over 100µ" nickle |
Solder Mask Apply To: | no solder mask required |
Solder Mask Color: | no solder mask required |
Solder Mask Type: | no solder mask required |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | no silkscreen required |
Colour of Component Legend | no silkscreen required |
Manufacturer Name or Logo: | no silkscreen required |
VIA | Plated Through Hole(PTH), via open |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Digital transmitter, 4G Router USB Bluetooth USB Bluetooth Adapter Adaptor Antennas |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages:
a) High frequency performance
b) Dielectric constant er 3.48
c) Low loss and high speed signal transmission.
d) Prototypes are offered for sale
More Applications in Electronics
Embedded Hardware
Embedded Systems Applications
Rf Power Amplifiers
Rf Modules
Switching Power
Design for Manufacture(DFM) (4)
Serial NO. | Procedure | Item | Manufacturing capability | ||
Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
62 | Surface finish | Thickness of nickel of ENIG | 3-5um | 3-5um | 2-6.35um |
63 | Thickness of Gold of ENIG | 0.05-0.1um | |||
64 | Thickness of nickel of Gold finger | 3-5um | |||
65 | Thickness of Gold of Gold finger | 0.1-1.27um | |||
66 | Thickness of tin of HASL | 2.54-6.35um | |||
67 | Thickness of OSP | 0.2-0.5um | |||
68 | Thickness of tin of Immersion tin | 0.2-0.75um | |||
69 | Thickness of silver of Immersion silver | 0.15-0.75um | |||
70 | Contour process | Method of contour process | CNC milling, V-CUT, Break-out tap, break-out holes, Punching | ||
71 | Minimum router | 0.8mm | |||
72 | Min.tolerance of contour | ±0.15mm | ±0.13mm | ±0.1mm | |
73 | Min.distance of milling contour(no copper exposure) | 12mil | 10mil | 8mil | |
74 | Angle of
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