High Frequency Printed Circuit Board Manufacturing 20Mil 1Oz Copper
 
PCB Properties

 
 
Advantages
a) RO4350B material. Stable electrical coefficient of dielectric constant.
b) Electroless nickle Immersion gold. SMT process is resistant to reflow soldering, resistant to rework.
c) No minimum order quantity. 1-10 pieces are offered for sale.
d) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
 
 
More Applications in Electronics
2000 Watt Inverter
Industrial Electronics
Mobile Radio
Electronic Cash Register
Linear Power Supply
High Speed Storage Networks
Routing and Switching Systems
Antenna
RF and Wireless Communication
Smart Phone and Cell Phone
 
 
PCB knowledge: PCB Production Process
1. Contact PCB fabricator

Contact your satisfied vendor such as Bicheng. You’re registered and will be quoted for you. Place your order and follow up the production schedule.
 
2. Material cutting

Purpose: According to the requirement from engineering data, cut the large plate which is in compliance with the requirement into small pieces of production board piece to meet customer requirements of the small sheet.
3. Drill

Purpose: According to the requirement from engineering data, drill all the holes.

 
4. Copper deposition

Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical method

 
5. Pattern transfer

Purpose: Pattern transfer is the transfer of image production on the film to the board
 
6. Pattern plating

Purpose: Pattern electroplating is a layer of copper or gold over nickel or tin that requires a thickness plated on the exposed copper of the pattern graphic or on the hole wall.
 
7. Film stripping

Purpose: The NaOH solution is used to strip the anti-plating film to expose the non-pattern circuit layer.
 
8. Etching

Purpose: Etching is to etch off the non-circuit parts of the copper layer by chemical reaction method
 
9. Solder Mask

Purpose: Solder mask is transferring the solder mask film graphics to the board to protect the track and prevent the track from the effect of tin welding during assembly.
 
10. Silkscreen

Purpose: The silkscreen character is a mark that is easy to recognize.
 
11. Edge connector plating (Gold finger)

Purpose: A nickel gold layer with a thickness is plated on the PCB edge of the plug to make it more resistant to wear.
 
HASL (a process of coordinate)
HASL is a layer of tin generated on the non-solder mask area to protect pad copper surface from oxidation to ensure good welding performance.
 
12. Contour

Purpose: By stamping or milling machine to cut the PCB into customers' required shape.
 
13. Electrical test

Purpose: Through the electronic 100% test to find the open circuit, short circuit and other functional defects which are not easy to find by visual inspection.
 
14. Final Inspection

Purpose: Through 100% visual inspection to find out the defects in appearance and repair minor defects to avoid problems and defects in the shipment.
 
Multilayer stackup: 6 layer .063" Finished Thickness

 
FAQ
Do you sell heavy copper PCB?
Yes. Heavy copper PCBs can withstand high current and have good heat dissipation, it has been satisfting the market of power convertion module boards which is used in
automobile electronics and electric equipment.