Place of Origin: | Zhejiang, China (Mainland) |
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Single Sided 2W / MK Metal Core PCB Immersion Gold For LED Lighting
PCB properties
PCB SIZE | 105 x 68mm=10PCS |
BOARD TYPE | |
Number of Layers | Single sided PCB |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | copper ------- 35um(1oz) |
2.0W/MK dielectric material | |
Aluminum base 6061 | |
TECHNOLOGY | |
Minimum Trace and Space: | 10mil/11.9mil |
Minmum / Maximum Holes: | no |
Number of Different Holes: | no |
Number of Drill Holes: | no |
Thermal resistance(°C/W) | ≤0.45 |
Breakdown Voltage(VDC) | 4000 |
Impedance Control | no |
BOARD MATERIAL | |
Thermal conductivity | T-Prepreg 1KA Dielectric |
Final foil external: | 1oz |
Final foil internal: | 0oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Electroless Nickle over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickle) |
Solder Mask Apply To: | Top. 12µm Minimum. |
Solder Mask Color: | Black |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | no silkscreen |
Colour of Component Legend | no silkscreen |
Manufacturer Name or Logo: | as per requirement |
VIA | no via |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | LED light |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) Metal core PCB. Effective heat dissipation reduces the operating temperature of the module, prolonging the service life. Power density and reliability are improved
b) Reduce the dependence of heat sinks and other hardware (including thermal interface materials), reduce the volume of the product, reduce the cost of hardware and assembly.
c) ISO certified PCB manufacturing factory.
d) No MOQ, low cost for small quantity prototypes and samples.
More Applications in Electronics
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Data Sheets of IT-140
ITEQ Laminate/ Prepreg : IT-140TC / IT-140BS | ||||||
IPC-4101A Spec / 21 | ||||||
LAMINATE(IT-140TC) | ||||||
Property | Thickness<0.50 mm | Thickness0.50 mm | Units | Test Method | ||
[0.0197 in] | [0.0197 in] | |||||
Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
(English) | (or as noted) | |||||
Peel Strength, minimum | N/mm | 2.4.8 | ||||
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
B. Standard profile copper foil | 0.96 (5.5) | 0.70 (4.0) | 0.96 (5.5) | 0.70 (4.0) | 2.4.8.3 | |
1. After Thermal Stress | ||||||
2. At 125°C [257 F] | ||||||
3. After Process Solutions | 1.75 (10 ) | 0.80 (4.57) | 1.93 (11.0) | 1.05 (6.00) | ||
1.66 (9.5) | 0.70 (4.00) | 1.66 (9.5) | 0.70 (4.00) | < |