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Immersion Gold Multilayer Circuit Board PCB Plated Through Hole Tg 170 Blind Via 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-150929-V1.2

Immersion Gold Multilayer Circuit Board PCB Plated Through Hole Tg 170 Blind Via
 
 
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Immersion Gold Multilayer Circuit Board PCB Plated Through Hole Tg 170 Blind Via

 

 

Product Parameter

PCB SIZE 230 x 209mm=48PCS
BOARD TYPE
Number of Layers Multilayer PCB, 4 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz) MidLayer 1
FR-4 1.0mm
copper ------- 18um(0.5oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 17.8um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 6.7mil/5.9mil
Minmum / Maximum Holes: 0.3/2.5mm
Number of Different Holes: 13
Number of Drill Holes: 2512
Number of Milled Slots: 144
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy: FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external: 1oz
Final foil internal: 0.5oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING
Surface Finish Immersion Gold (31.3%) 2 micoinch over 100 microinch nickle
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented. Blind via from to inner layer 1
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Voip system, Gps Tracker For Car
Step Up Transformer
USB Wireless
12 Volt Battery Charger
Wireless Speaker System
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) 94V0 flame retardant fiber.

b) High Tg material reliable.

c) Excellent solderability on gold flat surface

d) No minimum quantity required for buyers.

 

 

More Applications in electronics

Wlan Antenna
Car Inverters
Solar Power Inverters
Remote I/O
Interface Module

 

 

PCB knowledge: The Difficulty Factors for Multilayer boards

Multilayer PCB’s represent one of the most complicates products in PCB industry. In order to design producible multilayer PCB’s, it is imperative that PCB designers understand the processes and difficulty factors

 

*Build-up

The more layers in a multilayer PCB’s, the greater risk of mis-registration during laminate process. The difficulty factor, therefore, increase with an increasing layer counts.

 

*Core thickness of rigid inner laminates

Inner layers are normally based on thin rigid laminate cores with copper cladding. The thinner the rigid laminates, the more difficult they are to handle, for example, in the etching process.

 

*Thickness tolerance (total thickness inclusive of copper foils)

The difficulty factor and the rejection rate depend very much upon the thickness tolerance required, and indirectly upon the layer build-up. When thickness tolerance T=±10%, obviously rejection ratio trends to zero.

 

 

FAQ: Do you sell rigid-flex PCB?
Sorry. We currently do not offer rigid-flex PCB.

 

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 Mr. Mr. Kevin Liao

Tel: 86-755-27374946
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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