Place of Origin: | Zhejiang, China (Mainland) |
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FR4 10 Layer Via In Pads PCB Circuit Boards 1.6mm With Green Mask
PCB parameters
PCB SIZE | 99.1 x 105.3mm=1PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 10 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 17.5um(0.5oz)+plate TOP Signal |
4mil prepreg | |
copper ------- 18um(0.5oz) GND Plane | |
5mil FR-4 | |
copper ------- 18um(0.5oz) SIG1 | |
5mil prepreg | |
copper ------- 18um(0.5oz) SIG2 | |
5mil FR-4 | |
copper ------- 18um(0.5oz) PWR Plane | |
13mil prepreg | |
copper ------- 18um(0.5oz) GND Plane | |
5mil FR-4 | |
copper ------- 18um(0.5oz) SIG3 | |
5mil prepreg | |
copper ------- 35um(1oz) SIG4 | |
5mil FR-4 | |
copper ------- 35um(1oz) GND Plane | |
4mil prepreg | |
copper ------- 17.5um(0.5oz)+plate BOT Signal | |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minmum / Maximum Holes: | 0.3/5.5mm |
Number of Different Holes: | 31 |
Number of Drill Holes: | 1532 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | Differential pairs impedance control and Single trace impedance control |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
Final foil external: | 1oz |
Final foil internal: | 0.5oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (12.8%) 2µ" over 100µ" nickel |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP and Bottom. |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), Via in Pad and via tented and not be visible. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Satellite Phone |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) FR-4 Tg170. UL94V0 flame retardant. Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
b) Immersion gold PCB. High solderability, no stressing of circuit boards and less contamination of PCB surface.
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) ISO certified PCB manufacturing factory.
e) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications in Electronics
Microprocessor
Preamplifier
Microcontroller
Multiplexer
Satellite Receiver
ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS
IPC-4101C Spec / 99 / 101 / 126 | ||||||
LAMINATE( IT-180ATC) | ||||||
Property | Thickness<0.50 mm | Thickness0.50 mm | Units | Test Method | ||
[0.0197 in] | [0.0197 in] | |||||
Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
(English) | (or as noted) | |||||
Peel Strength, minimum | N/mm | 2.4.8 | ||||
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) |
Related SearchFind more related products in following catalogs on Hisupplier.comCompany InfoBICHENG ENTERPRISE LIMITED [China (Mainland)]
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