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Low Loise Amplifier High Speed Circuit Design High Density Interconnect PCB 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-468421-V2

Low Loise Amplifier High Speed Circuit Design High Density Interconnect PCB
 
PCB parameter
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Low Loise Amplifier High Speed Circuit Design High Density Interconnect PCB

 

PCB parameter

PCB SIZE 60 x 54mm=1PCS
BOARD TYPE
Number of Layers Double sided PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1oz)+plate TOP layer
RO4350B 20mil (0.508mm)
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 7.5mil/8.8mil
Minmum / Maximum Holes: 0.5/3.2mm
Number of Different Holes: 5
Number of Drill Holes: 191
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL
Glass Epoxy: RO4350B 20mil (0.508mm), Tg 288
Final foil external: 1.5oz
Final foil internal: 0oz
Final height of PCB: 0.6-0.7mm
PLATING AND COATING
Surface Finish Electroless Nickle over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickle)
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH)
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Low noise amplifier (LNA)
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) RO4350B substrate. Excellent high frequency performance due to low dielectric tolerance and loss.

b) Stable electrical coefficient of dielectric constant.

c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

 

 

More Applications in Electronics

AC Inverter
Wifi Antenna Booster
Wireless Broadband Router
Modem GSM
USB Adaptor

Hdmi Splitter
Switch Mode Power Supply
Memory Module
Consumer and Multilayer PCB
Game Player

 

 

PCB knowledge: ENIG

ENIG stands for Electroless nickel immersion gold which is a type of surface plating used for circuit boards. It consists of an electroless nickel plating covered with a thin layer of immersion gold. Normally, the thickness of nickel is 120µ” - 200µ” (3µm to 5µm ) and gold 1-5µ” (0.025µm – 0.127µm).

 

ENIG has several advantages than HASL, including

a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

b) Good oxidation resistance and good heat dissipation.

c) Long storage time ( It can be stored for more than 1 year in vacuum bag)

d) High solderability, no stressing of circuit boards and less contamination of PCB surface.

e) SMT process is resistant to reflow soldering, resistant to rework.

 

 

FAQ

Do you sell rigid-flex PCB?
Sorry. We currently do not offer rigid-flex PCB.

 

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 Mr. Mr. Kevin Liao

Tel: 86-755-27374946
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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