1oz Immersion Gold Impedance Controlled PCB 14 Layer FR-4 With BGA BIC-1213Y-32D manufacturer from China BICHENG ENTERPRISE LIMITED

1oz Immersion Gold Impedance Controlled PCB 14 Layer FR-4 With BGA

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: BIC-1213Y-32D

1oz Immersion Gold Impedance Controlled PCB 14 Layer FR-4 With BGA

PCB data sheets
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1oz Immersion Gold Impedance Controlled PCB 14 Layer FR-4 With BGA

PCB data sheets

PCB SIZE	210 x 101mm=1PCS=1design
BOARD TYPE
Number of Layers	Multilayer PCB, 14 layer PCB
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- TOP 17um(1oz)+plate
	65 um prepreg 1080 x 1
	copper ------- L02 35um(1oz)
	150um core FR-4
	copper ------- L03 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L04 35um(1oz)
	150um core FR-4
	copper ------- L05 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L06 35um(1oz)
	150um core FR-4
	copper ------- L07 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L08 35um(1oz)
	150um core FR-4
	copper ------- L09 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L10 35um(1oz)
	150um core FR-4
	copper ------- L11 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L12 35um(1oz)
	150um core FR-4
	copper ------- L13 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- BOT 17um(0.5oz)+plate
TECHNOLOGY
Minimum Trace and Space:	5 mil/5 mil
Minmum / Maximum Holes:	0.4/4.0mm
Number of Different Holes:	16
Number of Drill Holes:	2109
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	Single Trace Impedance Control, L1,L12, Track 20.1mil, 50Ohm. Differential Pairs Impedance Control, L1, L3, L5, L8, L10, L12, Track/Space 4.6mil / 8mil, 90Ohm
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	IT180A, FR-4 TG170, er<5.4, ITEQ Supplied
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	2.12mm ±0.2
PLATING AND COATING
Surface Finish	Immersion gold 0.05µm over 3µm Nickel (19.12% area)
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 GT600D, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), BGA, Epoxy Via plugging
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
APPLICATION:	Control industrial machinery
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages

a) High Tg substrate and Prepreg. Industrial standard material with high Tg (175 by DSC) and excellent thermal reliability.
b) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260

c) Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

e) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.

More Applications in Electronics

CCTV Security
Tracking Systems
Contract Manufacturer
PCB Connectors
Embedded Projects

PCB knowledge: The components of multilayer PCB--- Prepreg

A multilayer board consists of copper foils, thin rigid laminates and prepreg sheets.

Prepreg plays a role of bonding material used for bonding the individual thin laminates of the multilayer boards. It consists of glass cloth impregnated with epoxy resin. Unlike rigid laminates, the epoxy resin is only semi-cured. Epoxy resin is referred to as B-stage when semi-cured.

The prepreg sheets are not sticky. During lamination of the board, the epoxy resin is first changed to a liquid state and later in the press cycle to the fully cured state. During the press cycle, the cured epoxy resin in the thin, rigid laminates softens, but it does not become liquid.

Thicknesses of Prepreg sheets