Place of Origin: | Zhejiang, China (Mainland) |
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SAN Storage 4 Layer Tg 170 PCB FR 4 Immersion Gold Lead Free 1.5oz
PCB Data sheets
PCB SIZE | 132 x 155mm=20PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 4 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
Prepreg 7628 0.195mm | |
copper ------- 35um(1oz) MidLayer 1 | |
FR-4 1.0mm | |
copper ------- 35um(1oz) MidLayer 2 | |
Prepreg 7628 0.195mm | |
copper ------- 35um(1oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 7.87mil/6mil |
Minmum / Maximum Holes: | 0.5/1.0mm |
Number of Different Holes: | 2 |
Number of Drill Holes: | 975 |
Number of Milled Slots: | 46 |
Number of Internal Cutouts: | 0 |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
Final foil external: | 1.5oz |
Final foil internal: | 1oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (23.4%) 2micoinch over 100 microinch nickle |
Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing, Fiducial Marks |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | SAN storage |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) High Tg 170 material. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260
b) Immersion gold. Good oxidation resistance and good heat dissipation.
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) Eligible products rate of first production: >95%
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PCB Knowledge: HASL
Hot air solder leveling is for short HASL, which is a common type of surface finish used on printed circuit boards (PCBs). We dipped the PCBs (with exposed copper surfaces) into a bath of molten solder, then remove the excess solder on PCB surface and in the holes by strong hot air(which we call it HASL machine) to get a glossy layer of coating.
One is alloy of tin and lead. The temperature of smelting furnace for Tin/Led is about 240. Another one is pure tin, because lead is harmful to human body, EU has forbidden using tin/lead. So the popular is pure tin or HASL Lead free. The temperature of smelting furnace for pure tin is highly at 300, and plus the operating environment, high temperature and high etching are great harm on PCB itself. Due to its hot air generated, HASL has low planarity. It makes this surface finish unsuitable for use with fine pitch components. It has hidden danger of board warp or twist under high thermal stress. To avoid this disadvantages, high Tg material and PP are took into consideration for some PCB user. But it also has excellent wetting during component soldering and it can avoid copper corrosion. So it is also mostly used in single sided PCB, Double sided PCB and some multilayer PCB.
FAQ
What courier do you use for shipment?
Our courier includes DHL, Fedex, TNT and EMS. As per your order weight and location, we'll choose the most economic method to send you your boards to help to save the freight cost.
BICHENG ENTERPRISE LIMITED [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)