Network Gateway Four Layer PCB High Temperature Circuit Board Design BIC-1129FD-564M manufacturer from China BICHENG ENTERPRISE LIMITED

Network Gateway Four Layer PCB High Temperature Circuit Board Design

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: BIC-1129FD-564M

Network Gateway Four Layer PCB High Temperature Circuit Board Design

PCB data sheets
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Network Gateway Four Layer PCB High Temperature Circuit Board Design

PCB data sheets

PCB SIZE	280 x 152mm=4PCS
BOARD TYPE
Number of Layers	Multilayer PCB, 4 layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP layer
	Prepreg 0.203mm (8mil)
	copper ------- 18um(0.5oz) MidLayer 1
	FR-4 0.99 mm (39 mil)
	copper ------- 18um(0.5oz) MidLayer 2
	Prepreg 0.203mm (8mil)
	copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minmum / Maximum Holes:	0.4 / 4.3mm
Number of Different Holes:	17
Number of Drill Holes:	521
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 TG170, CTI 175V-249V, er<5.4. ITEQ Supplied
Final foil external:	1oz
Final foil internal:	0.5oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion gold 0.05µm over 3µm Nickel (13.2% area)
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Matt Blue, SKM-S6189BLM1, KUANGSHUN supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
APPLICATION:	Network gateway
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages
a) High Tg 170 substrate and Prepreg. Immersion gold PCB.
b) ISO certified PCB manufacturing factory.
c) Engineering design prevents problems from occurring in pre production.
d) Delivery on time. We keep higher than 95% on-time-delivery rate.
e) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.

More Applications in Electronics
3G Wifi Modem
AC/AC Adapter
Wireless USB Dongle
Inverters
Modem Usb 4G

Performance parameter of Aluminum, Copper, Iron and Ceremic

Material	Model	Hardness HB500KgF	Density (g/cm3)	Coefficient of thermal conductivity	Expansion coefficient(10E-6/K)
Aluminum	1100	32	2.71	218	23
Aluminum	5052	68	2.68	138	23
Aluminum	6061	95	2.7	155	23
Red copper	C1100	30	8.9	401	16.7
Iron	D3004	140	7.8	80	1.2
Ceramic	96% AL2O3	-	3.8	20-30	6

Reference drill table and contour fabricating drawing

FAQ
What's your minimum track and spacing?
Actually this depends on the copper weight.
For half oz(18um) copper, it's 3mil / 3.5mil for prototypes, 4mil / 4mil for small production and larger at 5mil / 5mil for mass production.
For 1oz (35um) copper, it's 3mil / 4mil for prototypes, 4mil / 4mil for small production and 5mil / 5mil for mass production.
For 2oz (70um) copper, it's 6mil / 7mil for prototypes, 6mil / 8mil for small production and 7mil / 9mil for mass production.
For 3oz (105um) copper, it's 8mil / 9mil for prototypes, 8mil / 10mil for small production and 9mil /11mil for mass production.
For 4oz (140um) copper, it's 12mil / 11mil for prototypes, 12mil / 12mil for small production and 13mil / 13mil for mass production.