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Antenna Green 2 Layer RF PCB 30mil 1 Oz High Frequency Circuit Design 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-596133-V8

Antenna Green 2 Layer RF PCB 30mil 1 Oz High Frequency Circuit Design
 
PCB properties
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Antenna Green 2 Layer RF PCB 30mil 1 Oz High Frequency Circuit Design

 

PCB properties

PCB SIZE 38 x 25mm=1PCS
BOARD TYPE
Number of Layers Double sided PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1oz)+plate TOP layer
RO4350B 30mil (0.762mm)
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 78mil/30mil
Minmum / Maximum Holes: 0.8/3.5mm
Number of Different Holes: 2
Number of Drill Holes: 53
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL
Glass Epoxy: RO4350B 30mil (0.762mm), Tg 288
Final foil external: 1.5oz
Final foil internal: 0oz
Final height of PCB: 0.8mm ±0.1
PLATING AND COATING
Surface Finish Electroless Nickle over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickle)
Solder Mask Apply To: Top,12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), Via tented
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Antenna
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) Lower temperature coefficient of dielectric constant .

b) Ideal for temperature sensitive applications.

c) Devlivery on time: >98%
d) Customer complaint rate: <1%

 

 

More Applications in Electronics

Router Antenna
Solar Power Inverter
Electric Converter
Computer Router
Solar Inverters

 

 

PCB knowledge: The process of multilayer PCB
A) In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.

B) Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press.

C) After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed.

 

Microsection, FR-4, 12 layers

 

 

FAQ

Do you sell cheap FR-1, CEM-1 PCB?
Yes, we just offer single sided PCB made of FR-1 and CEM-1. We also use punching tool for the contour for the mass production.

 

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 Mr. Mr. Kevin Liao

Tel: 86-755-27374946
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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