Place of Origin: | Zhejiang, China (Mainland) |
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1.6mm Single Trace Impedance Controlled PCB 8 Layer With Blue Solder Mask
PCB parameters
PCB SIZE | 99 x 93mm=1PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 8 layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
Prepreg 7628 0.195mm | |
copper ------- 35um(1oz) MidLayer 1 | |
FR-4 0.2mm | |
copper ------- 35um(1oz) MidLayer 2 | |
Prepreg 7628 0.195mm | |
copper ------- 35um(1oz) MidLayer 3 | |
FR-4 0.2mm | |
copper ------- 35um(1oz) MidLayer 4 | |
Prepreg 7628 0.195mm | |
copper ------- 35um(1oz) MidLayer 5 | |
FR-4 0.2mm | |
copper ------- 35um(1oz) MidLayer 6 | |
Prepreg 7628 0.195mm | |
copper ------- 18um(0.5oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minmum / Maximum Holes: | 0.3/5.0mm |
Number of Different Holes: | 21 |
Number of Drill Holes: | 5612 |
Number of Milled Slots: | 2 |
Number of Internal Cutouts: | 0 |
Impedance Control: | Single trace Impedance control, L1-L8, 4mil 50 ohm +/-10%, Differential pairs impedance control L1-L3-L4-L7-L8, 4.6mil/8mil, 90 ohm+/-10% |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | FR-4 TG170, er<5.4.IT-180, ITEQ Supplied |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion gold (9.1% ) 0.05µm over 3µm nickel |
Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
Solder Mask Color: | Blue, ONSTATIC supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing, stamp holes. |
MARKING | |
Side of Component Legend | TOP and Bottom. |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Isolated DC DC Converter |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) High Tg FR-4. Industrial standard material with high Tg (175 by DSC) and excellent thermal reliability.
b) Immersion gold PCB. SMT process is resistant to reflow soldering, resistant to rework.
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) Customer complaint rate: <1%
More Applications in Electronics
Embedded Technology
PCB Electronics
DC DC Step UP Converter
Micro PLC
PC Power Supplies
PCB knowledge: The process of multilayer PCB
A) In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.
B) Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press.
C) After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed.
FAQ
Do you sell blind via PCB?
Yes. Blind via is the hole starts from top layer or bottom layer and ends at one of inner layers. Blind via usually are plugged by epoxy resin and it's not visible by our eyes.
cross section- 12 layers
BICHENG ENTERPRISE LIMITED [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)