Place of Origin: | Zhejiang, China (Mainland) |
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Communication Networks 4 Layer PCB Hybrid RO4003C Core RO4450B PP Combined
PCB parameters
PCB SIZE | 73.5 x 55.97mm=1PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 4 layer PCB |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | copper ------- 17um(0.5oz)+plate TOP layer |
RO4003C 0.305mm (12mil) | |
copper ------- 35um(1oz) MidLayer 1 | |
RO4450B 0.101mm | |
copper ------- 35um(1oz) MidLayer 2 | |
FR-4 1.0mm | |
copper ------- 17um(0.5oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 5.9mil/6.1mil |
Minmum / Maximum Holes: | 0.3/3.5mm |
Number of Different Holes: | 6 |
Number of Drill Holes: | 320 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RO4003C 0.305mm (12mil) and FR-4 1.0mm combined |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (15.4%) 2 micoinch over 100 microinch nickle |
Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
Solder Mask Color: | Green, PSR-2000 GT600D, Taiyo Supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing. Fiducial marks |
MARKING | |
Side of Component Legend | TOP. |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated through hole(PTH), via tented. Blind via from top layer to Inner layer 1. Inner layer 2 to Bottom layer. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Communication networks |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) Hybrid material of RO4000 series material and FR-4.
b) Reduce signal loss in high frequency application and meet the development needs of communication technology.
c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
d) No minimum order quantity. 1-10 pieces are offered for sale.
e) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications in Electronics
TP Link 3G Router
GSM GPRS
Voltage Converters
Cellular Repeater
Wifi Directional Antenna
IT-180 Data Sheets (ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS)
IPC-4101C Spec / 99 / 101 / 126 | ||||||
LAMINATE( IT-180ATC) | ||||||
Property | Thickness<0.50 mm | Thickness0.50 mm | Units | Test Method | ||
[0.0197 in] | [0.0197 in] | |||||
Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
(English) | (or as noted) | |||||
Peel Strength, minimum | N/mm | 2.4.8 | ||||
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
B. Standard profile copper foil | 0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | 2.4.8.3 | |
1. After Thermal Stress | ||||||
2. At 125°C [257 F] |
Related SearchFind more related products in following catalogs on Hisupplier.comRelated ProductsCompany InfoBICHENG ENTERPRISE LIMITED [China (Mainland)]
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