Mobile Terminal 6 Layer PCB Immersion Gold Fr4 Circuit Board Assembly
| Place of Origin: | Zhejiang, China (Mainland) |
|
|
| Add to My Favorites | |
| HiSupplier Escrow |
Product Detail
Mobile Terminal 6 Layer PCB Immersion Gold Fr4 Circuit Board Assembly
PCB Data sheets
<table border=
Mobile Terminal 6 Layer PCB Immersion Gold Fr4 Circuit Board Assembly
PCB Data sheets
| PCB SIZE | 95.2 x 99.5mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 6 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628 x1 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.4mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628 x 1 0.195mm | |
| copper ------- 35um(1oz) MidLayer 3 | |
| FR-4 0.4mm | |
| copper ------- 35um(1oz) MidLayer 4 | |
| Prepreg 7628 x 1 0.195mm | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.9mil/7.84mil |
| Minmum / Maximum Holes: | 0.3/2.251mm |
| Number of Different Holes: | 15 |
| Number of Drill Holes: | 9915 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (11.8%) 4µ" over 100µ" nickle |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Mobile terminal |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) High Tg FR-4, Industrial standard material with high Tg (175 by DSC) and excellent thermal reliability
b) Immerson gold, Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
d) No MOQ, low cost for small quantity prototypes and samples.
More Applications in Electronics
Hsdpa Router
Universal Ac Power Supply
Low Noise Block
Electronic Manufacturer
Wireless Transmitters
PCB Knowledge: Specifications of FR-4
When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately.
FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254 µm) to 3 inches (76 mm).
Copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2 (300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1 µm (1.34 thou), 68.2 µm (2.68 thou), and 102.3 µm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35 µm (may also be referred to as 35 μ, 35 micron, or 35 mic).
1/0 - denotes 1 oz/ft2 copper one side, with no copper on the other side.
1/1 - denotes 1 oz/ft2 copper on both sides.
H/0 or H/H - denotes 0.5 oz/ft2 copper on one or both sides, respectively.
2/0 or 2/2 - denotes 2 oz/ft2 copper on one or both sides, respectively.
Due to the development needs of electronic product installation technology and PCB technology, the high Tg (Glass temperature) FR-4 products was born.
FAQ: How do you control the quality?
We believe engineering design prevents problems from occurring in preproduction. Our PCB and Manufacturing process are certified by authorized organizations.
100% tests are inclusive of electrical test and AOI inspection, high voltage test, impedance control test, micro-section, solder-ability test, thermal stress test,
reliability test, insulation resistance test and ionic contamination test etc.
Related Search
Find more related products in following catalogs on Hisupplier.com
Company Info
BICHENG ENTERPRISE LIMITED [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
