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1oz Double Sided PCB Assembly Design 0.6 mm Hot Air Solder Level 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-1310-VER2.1

1oz Double Sided PCB Assembly Design 0.6 mm Hot Air Solder Level
 
PCB Data Sheets
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1oz Double Sided PCB Assembly Design 0.6 mm Hot Air Solder Level

 

PCB Data Sheets

PCB SIZE 508.31 x 164.05mm=10PCS
BOARD TYPE
Number of Layers Double Sided PCB, 2 Layer PCB
Surface Mount Components YES
Through Hole Components No
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
FR-4 0.5mm
copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 12mil/12mil
Minmum / Maximum Holes: 0.5/1.1mm
Number of Different Holes: 3
Number of Drill Holes: 358
Number of Milled Slots: 11
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy: FR-4, ITEQ IT140 TG>135, er<5.4
Final foil external: 1oz
Final foil internal: 0oz
Final height of PCB: 0.6mm ±0.1
PLATING AND COATING
Surface Finish Hot air soldering leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Apply To: Top and Bottom, 12micron Minimum
Solder Mask Color: Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, Fiducial Marks
MARKING
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
APPLICATION: Level sensor switches
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

1) It’s suitable for handheld and consumer applications. It’s also Lead free compatible.

2) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

3) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

4) No MOQ, low cost for small quantity prototypes and samples.

 

 

More Applications In Electronics

RF
Wifi Router
Transformer
Adsl
Wifi Extender

Ac To Ac Power Supply
Power Supply Adaptor
Variable Power Supplies
Voltage Power Supply
Pwm Power Supply

 

 

IT-140 Data Sheets

ITEQ Laminate/ Prepreg : IT-140TC / IT-140BS
IPC-4101A Spec / 21
LAMINATE(IT-140TC)
Property Thickness<0.50 mm Thickness0.50 mm Units Test Method
[0.0197 in] [0.0197 in]
Typical Value Spec Typical Value Spec Metric IPC-TM-650
(English) (or as noted)
Peel Strength, minimum N/mm 2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] (lb/inch) 2.4.8.2
B. Standard profile copper foil 0.96 (5.5) 0.70 (4.0) 0.96 (5.5) 0.70 (4.0) 2.4.8.3
1. After Thermal Stress
2. At 125°C [257 F]
3. After Process Solutions 1.75 (10 ) 0.80 (4.57) 1.93 (11.0) 1.05 (6.00)
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 Mr. Mr. Kevin Liao

Tel: 86-755-27374946
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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