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1.6mm Blind Via Fr4 High Tg 170 FR 4 PCB 4 Layer For Temperature Module 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-16151-R1

1.6mm Blind Via Fr4 High Tg 170 FR 4 PCB 4 Layer For Temperature Module
 
PCB Data sheets
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1.6mm Blind Via Fr4 High Tg 170 FR 4 PCB 4 Layer For Temperature Module

 

PCB Data sheets

PCB SIZE 173 x 197mm=30PCS
BOARD TYPE
Number of Layers Multilayer PCB, 4 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz) MidLayer 1
FR-4 1.0mm
copper ------- 18um(0.5oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 7.9mil/5.9mil
Minmum / Maximum Holes: 0.3/0.3mm
Number of Different Holes: 1
Number of Drill Holes: 865
Number of Milled Slots: 90
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy: FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external: 1oz
Final foil internal: 0.5oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING
Surface Finish Immersion Gold (32.4%) 2 micoinch over 100 microinch nickle
Solder Mask Apply To: Top and Bottom, 12micron Minimum
Solder Mask Color: Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, Fiducial Marks
MARKING
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented, Blind via from top to inner layer 2
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
APPLICATION: Temperature module
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) Industrial standard material with high Tg (175 by DSC) and excellent thermal reliability.

b) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260

c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

d) DDU Door to door shipment with competitive shipping cost.

 

 

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Design for Manufacture (3)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
35 Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.5mm 0.5mm 0.5mm
36 Min.width of solder mask bridge Green:5mil(35um) Green:4mil(35um) Green:4mil(35um)
37 Yellow:5mil(35um) Yellow:4mil(35um) Yellow:4mil(35um)
38 Blue:5mil(35um) Blue:4mil(35um) Blue:4mil(35um)
39 Black:6mil(35um) Black:6mil(35um) Black:6mil(35um)
40 White:6mil(35um) White:6mil(35um) White:6mil(35um)
41 All of Matt:6mil All of Matt:6mil All of Matt:6mil
42 Green:5mil(70um) Green:4mil(70um) Green:4mil(70um)
43 Yellow:5mil(70um) Yello
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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