Yellow 6 Layer Via In Pad PCB Prototype Service 0.6mm Immersion Gold
 
PCB parameters

 
 
Advantages
a) Epoxy glass FR-4 grade. UL94V0
b) Immersion gold finish. High solderability, no stressing of circuit boards and less contamination of PCB surface.
c) via in pad design to save pcb room.
d) No MOQ, low cost for small quantity prototypes and samples.
e) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.
 
 
More Applications In Electronics
PLC Direct
Introduction To Embedded Systems
Koyo PLC
PLC Control System
Alert Systems
 
 
PCB knowledge: The components of multilayer PCB: copper foil
A multilayer board consists of copper foils, thin rigid laminates and prepreg sheets.
 
The standard thicknesses for copper foils are shown below

 
Thick copper (heavy copper) foils are used for voltage and ground planes by some electronics companies. Thicknesses up to 210 µm (6 oz) are specified for high voltage coil boards. For very fine-line boards, 5 and 9 µm (0.14 and 0.25 oz.), ultrathin copper foils are also used for the outer layers.
 
Copper foils are used as copper cladding of the thin laminates used in the inner layers. Such laminates can be delivered with different copper thicknesses on the two sides, for example, 17.5 µm (0.5 oz.) on one side for a signal layer and 35 µm (1 oz.) on the other side for ground or voltage planes.
 
Copper foils are sometimes used directly as cap foils for the outer layers. In such cases, the copper foils are bonded to the next layers by means of prepreg and form the outer layer circuits.
 
For signal outer layers, the copper foil thickness is usually 17.5 µm (0.5 oz.) or 35 µm (1 oz.) depending on the minimum track width and spacing. In the case of high-density fine-line boards, 5 or 9 µm (0.14 or 0.25 oz.) ultrathin copper foils can be the only solution to achieve the required high resolution when etching the board.
 
For signal inner layers, a 35 µm (1 oz.) copper foil is normally chosen. For ground and voltage planes, 35 µm (1 oz.) and 70 µm (2 oz.) copper foils can be used. However, the thicker foil, the more difficult it is to fill the apertures in the planes around the hole wall with epoxy flowing from the prepreg sheets during lamination.

 
FAQ
How to Pay?
We accept bank wi