RO4350B 20mil High Freqency 2 Layer PCB Immersion Gold For RF Module VX-201-R0.1 manufacturer from China BICHENG ENTERPRISE LIMITED

RO4350B 20mil High Freqency 2 Layer PCB Immersion Gold For RF Module

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: VX-201-R0.1

RO4350B 20mil High Freqency 2 Layer PCB Immersion Gold For RF Module PCB Data Sheets<table border="1" cellpadding="0" cel

RO4350B 20mil High Freqency 2 Layer PCB Immersion Gold For RF Module

PCB Data Sheets

PCB SIZE	16 x 83mm=1PCS
BOARD TYPE
Number of Layers	Double sided PCB, 2 Layer PCB
Surface Mount Components	YES
Through Hole Components	no
LAYER STACKUP	copper ------- 35um(1oz)+plate TOP layer
	RO4350B 20mil (0.508mm)
	copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5.98mil/6.18mil
Minmum / Maximum Holes:	0.3/3.2mm
Number of Different Holes:	5
Number of Drill Holes:	431
Number of Milled Slots:	0
Number of Internal Cutouts:	no
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	RO4350B 20mil (0.508mm), Tg 288
Final foil external:	1.5oz
Final foil internal:	0oz
Final height of PCB:	0.6mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Gold (81.1%) 2µ" over 100µ" nickle
Solder Mask Apply To:	Top and Bottom, 12micron Minimum
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH)
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
APPLICATION:	RF module
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages
a) RO4350B exhibits stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.
b) The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications.
c) No MOQ, low cost for small quantity prototypes and samples.
d) DDU Door to door shipment with competitive shipping cost.

More Applications in Electronics
Wireless Modem
Gps Systems
Analog Devices
Alarm Systems
Wireless Repeater
Modem 3G
Analogue Transmitter
Tower-Mounted Booster
Analogue Repeater
Multicoupler Combiner

Bicheng PCB capability

Parameter	Value
Layer Counts	1-32
Substrate Material	FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; 94HB and FR-1 (upon request)
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--420µm (0.5oz - 12oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger