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14 Layer BGA Circuit Board Assembly 2.0mm Thick For Industrial Communication 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-110197-R5

14 Layer BGA Circuit Board Assembly 2.0mm Thick For Industrial Communication
 
PCB properties
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14 Layer BGA Circuit Board Assembly 2.0mm Thick For Industrial Communication

 

PCB properties

PCB SIZE 215 x 152mm=1PCS=1design
BOARD TYPE
Number of Layers Multilayer PCB, 14 Layer PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- TOP 17um(1oz)+plate 25um
65 um prepreg 1080 x 1
copper ------- L02 35um(1oz)
150um core FR-4
copper ------- L03 35um(1oz)
65 um prepreg 1080 x 1
copper ------- L04 35um(1oz)
150um core FR-4
copper ------- L05 35um(1oz)
65 um prepreg 1080 x 1
copper ------- L06 35um(1oz)
150um core FR-4
copper ------- L07 35um(1oz)
65 um prepreg 1080 x 1
copper ------- L08 35um(1oz)
150um core FR-4
copper ------- L09 35um(1oz)
65 um prepreg 1080 x 1
copper ------- L10 35um(1oz)
150um core FR-4
copper ------- L11 35um(1oz)
65 um prepreg 1080 x 1
copper ------- L12 35um(1oz)
150um core FR-4
copper ------- L13 35um(1oz)
65 um prepreg 1080 x 1
copper ------- BOT 17um(0.5oz)+plate 25um
TECHNOLOGY
Minimum Trace and Space: 4.5mil/5mil
Minmum / Maximum Holes: 0.4/2.0mm
Number of Different Holes: 15
Number of Drill Holes: 3210
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL
Glass Epoxy: FR-4, IT-140, Tg >135, er<5.4
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 2.0mm ±10%
PLATING AND COATING
Surface Finish Electroless Nickle over Immersion Gold (ENIG)( 0.05µm over 3µm nickle)
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented. Via in pad under BGA package
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Industrial communication
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) Engineering design prevents problems from occurring in pre production.
b) Products and Manufacturing are certified by authorized organizations.
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) Eligible products rate of first production: >95%
e) Devlivery on time: >98%
f) Customer complaint rate: <1%

 

 

More Applications in Electronics

Antena Wifi USB
Bluetooth Device
GSM Modul
Online GPS
PCB Assembly

Duplexer
Optoelectronic Transmitters
Radio Frequency
Lnb
Microstrip Antenna

 

 

Design for Manufacture (2)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
14 Laminating Tolerance of laminate thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
15 Maximum laminate thickness 4.0mm
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 Mr. Mr. Kevin Liao

Tel: 86-755-27374946
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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