Output Control Tg 170 18 Layer Via In Pad PCB Controlled Impedance BIC-840122-V3 manufacturer from China BICHENG ENTERPRISE LIMITED

Output Control Tg 170 18 Layer Via In Pad PCB Controlled Impedance

Place of Origin:

Zhejiang, China (Mainland)


	Add to My Favorites
HiSupplier Escrow	Share \|

Product Detail

Model No.: BIC-840122-V3

Output Control Tg 170 18 Layer Via In Pad PCB Controlled Impedance PCB properties<table border="1" cellpadding="0" cells

Output Control Tg 170 18 Layer Via In Pad PCB Controlled Impedance

PCB properties

PCB SIZE	79 x 81mm=1PCS=1design
BOARD TYPE
Number of Layers	Multilayer PCB, 18 Layer PCB
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- TOP 17um(1oz)+plate 25um
	65 um prepreg 1080 x 1
	copper ------- L02 35um(1oz)
	150um core FR-4
	copper ------- L03 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L04 35um(1oz)
	150um core FR-4
	copper ------- L05 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L06 35um(1oz)
	150um core FR-4
	copper ------- L07 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L08 35um(1oz)
	150um core FR-4
	copper ------- L09 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L10 35um(1oz)
	150um core FR-4
	copper ------- L11 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L12 35um(1oz)
	150um core FR-4
	copper ------- L13 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L14 35um(1oz)
	150um core FR-4
	copper ------- L15 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- L16 35um(1oz)
	150um core FR-4
	copper ------- L17 35um(1oz)
	65 um prepreg 1080 x 1
	copper ------- BOT 17um(0.5oz)+plate 25um
TECHNOLOGY
Minimum Trace and Space:	5mil/5mil
Minmum / Maximum Holes:	0.3/2.0mm
Number of Different Holes:	12
Number of Drill Holes:	6720
Number of Milled Slots:	4
Number of Internal Cutouts:	0
Impedance Control	Differential pairs impedance: L3, 4 / 4 mil, 91ohm +/-10%; L4, 4 / 6 mil, 97ohm +/-10%; Single trace impedance: L3 / L4 / L7 / L8, 5mil, 56ohm +/-10%; L3 / L4 / L7, 6mil, 49ohm +/-10%
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180, TG>170, er<5.4
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	2.5mm ±10%
PLATING AND COATING
Surface Finish	Electroless Nickle over Immersion Gold (ENIG)( 0.05µm over 3µm nickle)
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented. Vin in pad under BGA package
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
APPLICATION:	Output control
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages
a) Industrial standard material with high Tg (175 by DSC) and excellent thermal reliability.
b) ITEQ IT-180. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260
c) Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
d) No minimum order quantity. 1-10 pieces are offered for sale.

More Applications in Electronics
Mobile Wifi Router
Mifi Router
Outdoor Wifi Antenna
2.4 Ghz Antenna
Pure Sine Inverter
UHF Radio
RF Module
RF Transceiver
RF Transmitter
Mixer

How to specify a PCB?
A PCB user generally needs to present all of the primary manufacturing data in a complete and unambiguous way that the PCB manufacturer can quote and produce the boards without error.

A checklist is listed as follows. Some parameters not necessary for a particular job can be deleted so that the specification form only reflects the relevant data.
(1) Company name
(2) Part number
(3) Lot size and annual requirements
(4) Layer count
(5) Board size
(6) Board thickness
(7) Board shape
(8) Panelization
(9) Board build-up
(10) Boards with controlled impedance
(11) Test coupon
(12) Machining (Contouring)
(13) Laminate type and UL flammability
(14) Warp & Twist
(15) Outer layers
(16) Inner layers
(17) Solderability preservation
(18) Solder masks
(19) Notation
(20) Peelable solder mask
(21) Carbon printing
(22) Plated through holes (PTHs)
(23) Non-PTHs
(24) Milled Holes (Slots)
(25) Blind via holes
(26) Buried via holes
(27) Board tooling holes
(28) Panel tooling holes
(29) Board mounting
(30) Edge connectors
(31) Soldering conditions
(32) Markings
(33) Electrical test
(34) Automatic optical inspection
(35) Minimum pattern conditions
(36) Quality conditions

FAQ
Do you sell cheap FR-1, CEM-1 PCB?
Yes, we just offer single sided PCB made of FR-1 and CEM-1. We also use punching tool for the contour for the mass production.