Place of Origin: | Zhejiang, China (Mainland) |
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Voltage Isolation Blue Multilayer PCB 2oz 4 Layer Board 3 Internal FR4 Cores
PCB parameters
PCB SIZE | 149 x 95mm=1PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 4 layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | Top layer, copper ------- 35um(1oz)+plate TOP layer |
Prepreg 7628 0.195mm x 3 sheets | |
Signal layer, copper ------- 70um(2oz) MidLayer 1 | |
FR-4 0.58mm | |
Signal layer, copper ------- 70um(2oz) MidLayer 2 | |
Prepreg 7628 0.195mm x 3 sheets | |
Bottom layer, copper ------- 35um(1oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 7.8mil/9.2mil |
Minmum / Maximum Holes: | 0.63/6.98mm |
Number of Different Holes: | 13 |
Number of Drill Holes: | 510 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | FR-4 TG135, er<5.4.IT-140, ITEQ Supplied |
Final foil external: | 2oz |
Final foil internal: | 2oz |
Final height of PCB: | 2.36mm ±0.24 |
PLATING AND COATING | |
Surface Finish | Immersion gold Immersion gold (12.1% ) 0.05um over 3um Nickle |
Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
Solder Mask Color: | Matt Blue, KSM-S6189BLM1, Kuangshun |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing. |
MARKING | |
Side of Component Legend | TOP. |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated through hole(PTH) |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Power board |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) FR-4 UL94V0. RoHS compliant and suitable for thermal reliability needs,and Lead free assemblies with a maximum reflow temperature of 260.
b) Engineering design prevents problems from occurring in pre production.
c) Immersion Gold Finish. Good oxidation resistance and good heat dissipation.
d) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
e) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications in Electronics
Display Drivers
GPS Transmitter
Signal Processor
DC Regulated Power Supply
DC Power Supplies
MCPCB Capability
NO. | Parameter | Value |
1 | Type of Metal Core | Aluminum, Copper, Iron |
2 | Model of Metal Core | A1100, A5052, A6061, A6063, C1100 |
3 | Surface Finish | HASL, Immersion Gold, Immersion Silver, OSP |
4 | Thickness of Surface plating | HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm |
5 | Layer Count | 1-4 Layers |
6 | Maximum of Board Size | 23" x 46" (584mm×1168mm) |
7 | Mininum of Board Size | 0.1969" x 0.1969" (5mm×5mm) |
8 | Board Thickness | 0.0157" x 0.2362" (0.4-6.0mm) |
9 | Copper Thickness | 0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) |
10 | Minimum Track Width | 5mil (0.127mm) |
11 | Minimum Space | 5mil (0.127mm) |
12 | Minimum Hole Size | 0.0197" (0.5mm) |
13 | Maximum Hole Size | No limit |
14 | Minimum Holes Punched | <