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GPRS BGA Circuit Board Design FR 4 Tg 170 Blind Via PCB 8 Layer
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Model No.:
BIC-053105-V1.8
GPRS BGA Circuit Board Design FR 4 Tg 170 Blind Via PCB 8 Layer
PCB parameter
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GPRS BGA Circuit Board Design FR 4 Tg 170 Blind Via PCB 8 Layer
PCB parameter
| PCB SIZE | 195 x 100mm=2PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 8 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 3 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 4 | |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 5 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 6 | |
| Prepreg 7628 0.195mm | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minmum / Maximum Holes: | 0.3/2.5mm |
| Number of Different Holes: | 16 |
| Number of Drill Holes: | 12530 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170, ITEQ IT-180 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (13.3%) 2µ" over 100µ" nickle |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), Fine pitch BGA, via pluged by epoxy resin |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | GPRS, Data Logger Intercom System Surveillance System DD DD Converter Power Inverters |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages:
a) 100% E test before shipment, free of charge for protoypes
b) ITEQ IT-180, reliable CCL vendor
c) Via in pad under BGA for density SMD components
d) No MOQ, Door to door service
More Applications in Electronics
Plc Books
Acces Control
Car Tracking Systems
3G Modem Wifi
Dc To Ac Conversion
Data Sheet of IT-180
| ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS | ||||||
| IPC-4101C Spec / 99 / 101 / 126 | ||||||
| LAMINATE( IT-180ATC) | ||||||
| Property | Thickness<0.50 mm | Thickness0.50 mm | Units | Test Method | ||
| [0.0197 in] | [0.0197 in] | |||||
| Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
| (English) | (or as noted) | |||||
| Peel Strength, minimum | N/mm | 2.4.8 | ||||
| A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
| B. Standard profile copper foil | 0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | 2.4.8.3 | |
| 1. After Thermal Stress | ||||||
