Place of Origin: | Zhejiang, China (Mainland) |
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Green Immersion Gold PCB Via In Pad 10 Layer Tg170 FR4 For Satellite Radio
PCB parameters
PCB SIZE | 221 x 211mm=1PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 10 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP Signal |
4mil prepreg | |
copper ------- 18um(0.5oz) GND Plane | |
5mil FR-4 | |
copper ------- 18um(0.5oz) SIG1 | |
5mil prepreg | |
copper ------- 18um(0.5oz) SIG2 | |
5mil FR-4 | |
copper ------- 18um(0.5oz) PWR Plane | |
13mil prepreg | |
copper ------- 18um(0.5oz) GND Plane | |
5mil FR-4 | |
copper ------- 18um(0.5oz) SIG3 | |
5mil prepreg | |
copper ------- 35um(1oz) SIG4 | |
5mil FR-4 | |
copper ------- 35um(1oz) GND Plane | |
4mil prepreg | |
copper ------- 35um(1oz)+plate BOT Signal | |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minmum / Maximum Holes: | 0.25/6.5mm |
Number of Different Holes: | 27 |
Number of Drill Holes: | 4182 |
Number of Milled Slots: | 3 |
Number of Internal Cutouts: | 0 |
Impedance Control | Differential pairs impedance control, Layer 4 and layer 7, 4/4mil, 5/21mil 90ohm+/-10%. Single trace impedance control: Layer 1, L3, L10, 8mil, 10mil track 50ohm +/-10% |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
Final foil external: | 1.5oz |
Final foil internal: | 0.5oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (19.1%) 2µ" over 100µ" nickel |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), Via in Pad and via tented and not be visible. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Power Inverter |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) UL94V0 FR-4 Tg170. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260
b) Electroless Nickel Immersion Gold (ENIG). Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
c) No MOQ, low cost for small quantity prototypes and samples.
d) ISO certified PCB manufacturing factory.
e) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications in Electronics
Gps Systems
Security Systems
Automation
Satellite Radio
Inverter Generator
Data Sheets of IT-140 FR-4
ITEQ Laminate/ Prepreg : IT-140TC / IT-140BS | ||||||
IPC-4101A Spec / 21 | ||||||
LAMINATE(IT-140TC) | ||||||
Property | Thickness<0.50 mm | Thickness0.50 mm | Units | Test Method | ||
[0.0197 in] | [0.0197 in] | |||||
Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
(English) | (or as noted) | |||||
Peel Strength, minimum | N/mm | 2.4.8 | ||||
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] |
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Find more related products in following catalogs on Hisupplier.comCompany InfoBICHENG ENTERPRISE LIMITED [China (Mainland)]
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