Place of Origin: | Zhejiang, China (Mainland) |
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Aluminum Framed SMT Stencil Stainless Foil 100% Laser Cut Stencil Stencil Foil
Stencil Specifications
Stencil dimension: | 300 x 300mm, 600 x 600mm |
Structure | Stencil foils, Aluminum framed |
Material | Stainless steel shim |
Foil Thickness | 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm |
Aperture configured | Laser cut |
Appearance | Engraving and electro polishing |
Fiducial mark | dented |
Service area: | Worldwide |
Application | CSP, BGA, Fine QFP etc. package |
Advantages
a) 100% laser cut. 12 years manufacturing experience.
b) No MOQ. Small stencil with aluminum frame at 250 x 300mm. Small stencil foil at 100 x 150mm.
c) Devlivery on time: >99%
d) Customer complaint rate: <1%
e) DDU Door to door shipment with competitive shipping cost.
IT-140 Properties Data Sheets
ITEQ Laminate/ Prepreg : IT-140TC / IT-140BS | ||||||
IPC-4101A Spec / 21 | ||||||
LAMINATE(IT-140TC) | ||||||
Property | Thickness<0.50 mm | Thickness0.50 mm | Units | Test Method | ||
[0.0197 in] | [0.0197 in] | |||||
Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
(English) | (or as noted) | |||||
Peel Strength, minimum | N/mm | 2.4.8 | ||||
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
B. Standard profile copper foil | 0.96 (5.5) | 0.70 (4.0) | 0.96 (5.5) | 0.70 (4.0) | 2.4.8.3 | |
1. After Thermal Stress | ||||||
2. At 125°C [257 F] | ||||||
3. After Process Solutions | 1.75 (10 ) | 0.80 (4.57) | 1.93 (11.0) | 1.05 (6.00) | ||
1.66 (9.5) | 0.70 (4.00) | 1.66 (9.5) | 0.70 (4.00) | |||
1.49 (8.5) | 0.55 (3.14) | 1.49 (8.5) | 0.80 (4.57) | |||
Volume Resistivity, minimum | MW-cm | 2.5.17.1 | ||||
A. C-96/35/90 | 5x1010 | 106 | -- | -- | ||
B. After moisture resistance | -- | -- | 5x1010 | 104 | ||
C. At elevated temperature E-24/125 | 5x1010 | 103 | 5x1010 | 103 | ||
Surface Resistivity, minimum | MW | 2.5.17.1 | ||||
A. C-96/35/90 | 3.5x1010 | 104 | -- | -- | ||
B. After moisture resistance | -- | -- | 3.5x1010 | 104 | ||
C. At elevated temperature E-24/125 | 6x1010 | 103 | 6x1010 | 103 | ||
Moisture Absorption, maximum | 0.3 | -- | 0.1 | 0.8 | % | 2.6.2.1 |
Dielectric Breakdown, minimum | -- | -- | 60 | 40 | kV | 2.5.6 |
Permittivity (Dk, 50% resin content) | 4.6 | 5.4 | 4.6 | 5.4 | -- | 2.5.5.9 |
(Laminate & Laminated Prepreg) | ||||||
A. 1MHz | ||||||
Loss Tangent (Df, 50% resin content) | 0.016 | 0.035 | 0.016 | 0.035 | -- | 2.5.5.9 |
(Laminate & Laminated Prepreg) | ||||||
A. 1MHz | ||||||
Flexural Strength, minimum | N/mm2 | 2.4.4 | ||||
A. Le
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