4 Layer BGA Circuit Board FR 4 1.6mm MultiLayer 1 Oz Copper With ENIG
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
4 Layer BGA Circuit Board FR 4 1.6mm MultiLayer 1 Oz Copper With ENIG
PCB parameters
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4 Layer BGA Circuit Board FR 4 1.6mm MultiLayer 1 Oz Copper With ENIG
PCB parameters
| PCB SIZE | 198 x 174mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17.5um(0.5oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 1.0mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 17.5um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5mil /5.5mil |
| Minmum / Maximum Holes: | 0.3/4.28mm |
| Number of Different Holes: | 23 |
| Number of Drill Holes: | 8379 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT140 TG>135, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel) |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), Ball grid array(BGA) package |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Access Point |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) 94V0 FR-4 Tg135. RoHS compliant and suitable for thermal reliability needs,and Lead free assemblies with a maximum reflow temperature of 260.
b) Immersion gold PCB. Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
c) ISO certified PCB manufacturing factory.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications in Electronics
Adapter
Bluetooth Receiver
Wlan
Consumer Electronics
Wlan Router
Repeater
Sound System
PCB knowledge: ENIG
ENIG stands for Electroless nickel immersion gold which is a type of surface plating used for circuit boards. It consists of an electroless nickel plating covered with a thin layer of immersion gold. Normally, the thickness of nickel is 120µ” - 200µ” (3µm to 5µm ) and gold 1-5µ” (0.025µm – 0.127µm).
ENIG has several advantages than HASL, including
a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
b) Good oxidation resistance and good heat dissipation.
c) Long storage time ( It can be stored for more than 1 year in vacuum bag)
d) High solderability, no stressing of circuit boards and less contamination of PCB surface.
e) SMT process is resistant to reflow soldering, resistant to rework.
FAQ
Do you sell MCPCB?
Yes. We offer metal core PCB(MCPCB), single sided and double sided, aluminum core and copper core, 1W/MK, 2W/MK and 3W/MK etc.
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Company Info
BICHENG ENTERPRISE LIMITED [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
