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Four Layer Tg135 Blind Via PCB Immersion Gold Satellite Antenna Circuit Board 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: BIC-182031-R5

Four Layer Tg135 Blind Via PCB Immersion Gold Satellite Antenna Circuit Board
 
PCB data sheets
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Four Layer Tg135 Blind Via PCB Immersion Gold Satellite Antenna Circuit Board

 

PCB data sheets

PCB SIZE 116 x 71mm=1PCS
BOARD TYPE
Number of Layers Multilayer PCB, 4 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 35um(1oz) MidLayer 1
FR-4 1.0mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 7mil/7.5mil
Minmum / Maximum Holes: 0.6/3.5mm
Number of Different Holes: 15
Number of Drill Holes: 1154
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL
Glass Epoxy: FR-4, ITEQ IT-140, TG>135, er<5.4
Final foil external: 1.5oz
Final foil internal: 1oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING
Surface Finish Electroless Nickle over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickle)
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied. Peelabel mask.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented. Blind via from Inner layer 2 to Bottom side.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Satellite antenna
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) FR-4 sustrate. It’s suitable for handheld and consumer applications. It’s also Lead free compatible.

b) Immersion gold. Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering

c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

d) No minimum order quantity. 1-10 pieces are offered for sale.

 

 

More Applications in Electronics

Broadband Router
GSM Gateway
USB GPS
Wireless Transmitter
Wireless Alarm

Electronic Lock
Electronic Cash Register
Ir Module
Audio Interface
Climate Controller

 

 

PCB knowledge: Layer Stackup

The purpose of stackup is to interleave the thin laminates and the prepreg sheets in correct sequence and ensure correct layer-to-layer registration. The stackup of multilayer boards can be done in many different ways.

Among multilayer PCB's, 12- layer is the largest number of layers that can be produced easily in 1.6mm thick.

 

Hybrid PCB stack up

4 layer PCB, RO4350B combined with FR-4 Core.

 

 

Genuine RO4350B 4 layer PCB vs FR-4 4 layer PCB

 

Build-up of FR-4 PCB (4 layer)                                       Build-up of RO4350B PCB (4 layer)

Copper track --- Layer 1                                                    Copper track --- Layer 1

Prepreg(PP)                                                                       RO4350B Core

Copper track --- Layer 2                                                     Copper track --- Layer 2

FR-4 Core                                                                          Rogers Prepreg(PP)

Copper track --- Layer 3     &nbs

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 Mr. Mr. Kevin Liao

Tel: 86-755-27374946
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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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