8 Layer High Tg PCB FR4 1.6mm Immersion Gold Multilayer Circuit Board BIC-0906-VER1 manufacturer from China BICHENG ENTERPRISE LIMITED

8 Layer High Tg PCB FR4 1.6mm Immersion Gold Multilayer Circuit Board

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: BIC-0906-VER1

8 Layer High Tg PCB FR4 1.6mm Immersion Gold Multilayer Circuit Board

PCB Data Sheets
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8 Layer High Tg PCB FR4 1.6mm Immersion Gold Multilayer Circuit Board

PCB Data Sheets

PCB SIZE	215 x 212mm=1PCS
BOARD TYPE
Number of Layers	Multilayer PCB, 8 layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP layer
	Prepreg 7628 0.195mm
	copper ------- 35um(1oz) MidLayer 1
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 2
	Prepreg 7628 0.195mm
	copper ------- 35um(1oz) MidLayer 3
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 4
	Prepreg 7628 0.195mm
	copper ------- 35um(1oz) MidLayer 5
	FR-4 0.2mm
	copper ------- 35um(1oz) MidLayer 6
	Prepreg 7628 0.195mm
	copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4mil/4mil
Minmum / Maximum Holes:	0.3/3.2mm
Number of Different Holes:	18
Number of Drill Holes:	11584
Number of Milled Slots:	2
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 TG170, er<5.4.IT-180, ITEQ Supplied
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion gold (32.1% ) 0.05µm over 3µm Nickle
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, stamp holes.
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
APPLICATION:	Codec
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages

a) High Tg material. Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.

b) Immersion gold. Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

More Applications In Electronics

Electronics
Gps
Converter
Bluetooth
Bluetooth Headphones

Programmable Logic Controller Plc
Programmable Ac Power Supply
Traco Power Supply
The Power Supply
Power Supply Inverter

PCB knowledge: PCB production process

1. Contact PCB fabricator

Contact your satisfied vendor such as Bicheng. You’re registered and will be quoted for you. Place your order and follow up the production schedule.

2. Material cutting

Purpose: According to the requirement from engineering data, cut the large plate which is in compliance with the requirement into small pieces of production board piece to meet customer requirements of the small sheet.

3. Drill

Purpose: According to the requirement from engineering data, drill all the holes.

4. Copper deposition

Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical method

5. Pattern transfer

Purpose: Pattern transfer is the transfer of image production on the film to the board

6. Pattern plating

Purpose: Pattern electroplating is a layer of copper or gold over nickel or tin that requires a thickness plated on the exposed copper of the pattern graphic or on the hole wall.

7. Film stripping

Purpose: The NaOH solution is used to strip the anti-plating film to expose the non-pattern circuit layer.

8. Etching

Purpose: Etching is to etch off the non-circuit parts of the copper layer by chemical reaction method

9. Solder Mask

Purpose: Solder mask is transferring the solder mask film graphics to the board to protect the track and prevent the track from the effect of tin welding during assembly.

10. Silkscreen