1 Oz 8 Layer BGA Circuit Board Assembly FR-4 Tg 170 PCB Immersion Gold
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
1 Oz 8 Layer BGA Circuit Board Assembly FR-4 Tg 170 PCB Immersion Gold PCB parameters<table border="1" cellpadding="0" ce
1 Oz 8 Layer BGA Circuit Board Assembly FR-4 Tg 170 PCB Immersion Gold
PCB parameters
| PCB SIZE | 162 x 374mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 8 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 3 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 4 | |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 5 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 6 | |
| Prepreg 7628 0.195mm | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 3mil/4mil |
| Minmum / Maximum Holes: | 0.3/4.9mm |
| Number of Different Holes: | 19 |
| Number of Drill Holes: | 3155 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (22.1%) 2µ" over 100µ" nickel |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), BGA package and via tented |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Gps Tracking |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) UL94V0 FR-4 epoxy glass. Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
b) Immersion gold surface finish. SMT process is resistant to reflow soldering, resistant to rework.
c) ISO certified PCB manufacturing factory.
d) No MOQ, low cost for small quantity prototypes and samples.
e) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.
More Applications in Electronics
Modem Wifi
Ac Adapter
Belkin Router
POS System
Embedded Systems
PCB knowledge: Printed circuit board (PCB)
Printed circuit board (short for PCB) is an important electronic part. It is the supporting body of electronic component and the electrical connection supporter of electronic component. Since it’s made by electronic printing, it’s called printed circuit board.
Role
After PCBs are applied in electronic equipment, since it’s consistency of the same board, it confidently avoids the error of manual wiring. PCB can achieve the automatic pick and place or surface mounting, automatic soldering, automatic inspection. It guarantees the quality of electronic equipment. The labor productivity is improved, the cost is reduced and the maintenance is convenient.
Development
Printed circuit board develops from single sided to double sided, multilayer and flexible, and still maintain their own development trends. Due to the continuous development of high precision, high density and high reliability, and constantly reduce the volume, reduce costs, improve performance, making the printed circuit board in the future development of electronic equipment, still maintained a strong vitality.
Review on the future development trend, the manufacturing technology of PCB mainly is consistent, namely high density, high precision, small diameter, thin track, fine pitch, high reliable, multilayer, high-speed transmission, light weight, thin direction. To improve productivity, reduce costs, reduce pollution, adapt to many varieties and small batch production are the production direction at the same time. The technology development level of printed circuit boards, it is regarded with line width, PCB drill, aspect ratio as a representative.
History
The creator of printed circuit board is Austrian engineer Paul Eisler. He invented the printed circuit as part of a radio set while working in England around 1936. In 1943, The USA began to use the technology on military radio. In 1948, the USA released the invention for commercial use. Since the mid-1950s, printed circuits became commonplace in consumer electronics and began to be widely used.
Before PCB, the interconnection between the electronic components is relying on the wires directly connected to complete. Nowadays, only in the laboratory test wire exists. Printed circuit board in the electronics industry has occupied the absolute control status.
FAQ
What's your minimum isolation of layers?
The minimum thickness of prepreg in inner layer is 0.06mm for prototypes, and thicker at 0.1mm for mass production.
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Company Info
BICHENG ENTERPRISE LIMITED [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
