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BICHENG ENTERPRISE LIMITED  

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Company Info

BICHENG ENTERPRISE LIMITED [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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  • Blue Impedance Controlled PCB 4 Layers FR-4 Printed Circuit Board Design

Blue Impedance Controlled PCB 4 Layers FR-4 Printed Circuit Board Design

BIC-09110-V3

Blue Impedance Controlled PCB 4 Layers FR-4 Printed Circuit Board Design PCB parameters<table border="1" cellpaddi

2016-10-14

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  • High Tg 170 PCB Double Sided 1.6mm 1oz HASL For Power Inverter

High Tg 170 PCB Double Sided 1.6mm 1oz HASL For Power Inverter

BIC-182331-R6

High Tg 170 PCB Double Sided 1.6mm 1oz HASL For Power Inverter
 
PCB Parameters
<table border="1" cell

2016-10-14

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  • 3G Modem High Tg PCB 8 Layer Quick Turn PCB Assembly Oxidation Resistance

3G Modem High Tg PCB 8 Layer Quick Turn PCB Assembly Oxidation Resistance

BIC-181513-R9

3G Modem High Tg PCB 8 Layer Quick Turn PCB Assembly Oxidation Resistance
 
PCB parameters
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2016-10-14

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  • Thin 0.4mm PCB 4 Layer Immersion Gold Plated Through Hole Circuit Board

Thin 0.4mm PCB 4 Layer Immersion Gold Plated Through Hole Circuit Board

BIC-43712-V3

Thin 0.4mm PCB 4 Layer Immersion Gold Plated Through Hole Circuit Board
 
PCB Parameters
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2016-10-14

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  • 1oz High Tg PCB Double Sided Circuit Board HASL With Green Solder Mask

1oz High Tg PCB Double Sided Circuit Board HASL With Green Solder Mask

BIC-433345-V3.2

1oz High Tg PCB Double Sided Circuit Board HASL With Green Solder Mask  PCB parameters<table border="1" cellpadd

2016-10-14

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  • White High Tg 170 1.6mm HASL Lead Free PCB Assembly Services For PLC Control

White High Tg 170 1.6mm HASL Lead Free PCB Assembly Services For PLC Control

BIC-17726-R1.3

White High Tg 170 1.6mm HASL Lead Free PCB Assembly Services For PLC Control
 
PCB parameters
<table borde

2016-10-14

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  • Green 6 Layer High Tg PCB 1.6mm 1oz In Circuit Board Components

Green 6 Layer High Tg PCB 1.6mm 1oz In Circuit Board Components

BIC-17235-R1.1

Green 6 Layer High Tg PCB 1.6mm 1oz In Circuit Board Components
 
PCB parameters
<table border="1" cellpad

2016-10-14

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  • High Temperature Double Side PCB FR4 Immersion Gold With Blue Solder Mask

High Temperature Double Side PCB FR4 Immersion Gold With Blue Solder Mask

BIC-170935-R2

High Temperature Double Side PCB FR4 Immersion Gold With Blue Solder Mask
 
PCB parameter
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2016-10-14

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  • Green RO435B FR4 Hybrid PCB 4 Layers 0.508mm Dielectric Immersion Gold PCB

Green RO435B FR4 Hybrid PCB 4 Layers 0.508mm Dielectric Immersion Gold PCB

BIC-53153-R8.1

Green RO435B FR4 Hybrid PCB 4 Layers 0.508mm Dielectric Immersion Gold PCB
 
PCB parameters
<table bor

2016-10-14

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  • Voltage Isolation Blue Multilayer PCB 2oz 4 Layer Board 3 Internal FR4 Cores

Voltage Isolation Blue Multilayer PCB 2oz 4 Layer Board 3 Internal FR4 Cores

BIC-111168-R9

Voltage Isolation Blue Multilayer PCB 2oz 4 Layer Board 3 Internal FR4 Cores
 
 
PCB parameter

2016-10-14

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  • Signal Generator Board FR4 Ball Grid Array PCB 8 Layer Matt Green Solder Mask

Signal Generator Board FR4 Ball Grid Array PCB 8 Layer Matt Green Solder Mask

BIC-1103458-V3

Signal Generator Board FR4 Ball Grid Array PCB 8 Layer Matt Green Solder Mask
 
PCB parameters
<table

2016-10-14

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  • Communication Networks 4 Layer PCB Hybrid RO4003C Core RO4450B PP Combined

Communication Networks 4 Layer PCB Hybrid RO4003C Core RO4450B PP Combined

BIC-101513-V3

Communication Networks 4 Layer PCB Hybrid RO4003C Core RO4450B PP Combined
 
PCB parameters
<table bo

2016-10-14

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  • 1oz Immersion Gold Green PC Board Prototyping High Tg 2 Layer PCB

1oz Immersion Gold Green PC Board Prototyping High Tg 2 Layer PCB

BIC-144835-TA7

1oz Immersion Gold Green PC Board Prototyping High Tg 2 Layer PCB
 
PCB properties
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2016-10-14

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  • 1 Oz 4 Layer Blind Via PCB FR4 1.6mm Module PCB Green Plated Through Hole

1 Oz 4 Layer Blind Via PCB FR4 1.6mm Module PCB Green Plated Through Hole

BIC-144465-NB

1 Oz 4 Layer Blind Via PCB FR4 1.6mm Module PCB Green Plated Through Hole
 
PCB properties
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2016-10-14

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  • Fine Pitch BGA Assembly Circuit Board 18 Layer Impedance Controlled PCB Via In Pad

Fine Pitch BGA Assembly Circuit Board 18 Layer Impedance Controlled PCB Via In Pad

BIC-14358F-A

Fine Pitch BGA Assembly Circuit Board 18 Layer Impedance Controlled PCB Via In Pad
 
PCB properties
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2016-10-14

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  • Tg 170 16 Layer BGA PCB Immersion Gold Fr4 Circuit Board 2.4mm

Tg 170 16 Layer BGA PCB Immersion Gold Fr4 Circuit Board 2.4mm

BIC-H35874-A5

Tg 170 16 Layer BGA PCB Immersion Gold Fr4 Circuit Board 2.4mm PCB Propteries<table border="1" cellpadding="0" cellspacin

2016-10-14

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